Synergistic effects of hybrid fillers on the development of thermally conductive polyphenylene sulfide composites
Siu Ning Leung
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Search for more papers by this authorMuhammad Omer Khan
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Search for more papers by this authorEllen Chan
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Search for more papers by this authorCorresponding Author
Hani E. Naguib
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8===Search for more papers by this authorFrancis Dawson
Department of Electrical and Computer Engineering, University of Toronto, Toronto, ON, Canada M5G 3G4
Search for more papers by this authorVincent Adinkrah
AEG Power Solutions Inc., 2680 Fourteenth Avenue, Markham, ON, Canada L3R 5B2
Search for more papers by this authorLaszlo Lakatos-Hayward
AEG Power Solutions Inc., 2680 Fourteenth Avenue, Markham, ON, Canada L3R 5B2
Search for more papers by this authorSiu Ning Leung
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Search for more papers by this authorMuhammad Omer Khan
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Search for more papers by this authorEllen Chan
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Search for more papers by this authorCorresponding Author
Hani E. Naguib
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada M5G 3G8===Search for more papers by this authorFrancis Dawson
Department of Electrical and Computer Engineering, University of Toronto, Toronto, ON, Canada M5G 3G4
Search for more papers by this authorVincent Adinkrah
AEG Power Solutions Inc., 2680 Fourteenth Avenue, Markham, ON, Canada L3R 5B2
Search for more papers by this authorLaszlo Lakatos-Hayward
AEG Power Solutions Inc., 2680 Fourteenth Avenue, Markham, ON, Canada L3R 5B2
Search for more papers by this authorAbstract
The future of integrated circuits with three-dimensional chip architecture hinges on the development of practical solutions for the management of excessive amounts of heat generation. This requires new polymer–matrix composites (PMCs), with good processibility, high effective thermal conductivity (keff), and low but tailored electrical conductivity (σ). This article explores the synergy of hybrid fillers: (i) hexagonal boron nitride (hBN) platelets with different sizes and shapes; (ii) hBN platelets with carbon-based fillers promoting the keff of the polyphenylene sulfide (PPS) composites. It explores the promotion of interconnectivity among the fillers in the PPS matrix, leading to higher keff, by the uses of hybrid fillers. It discusses using carbon-based fillers as secondary fillers to tailor the PMCs' σ. Finally, it presents the effects of hybrid fillers on the PMCs' coefficient of thermal expansion. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013
References
- 1 Xie, Y. Proc. VLSI Des. 2010, 446.
- 2 Sillon, N.; Astier, A.; Boutry, H.; Di Cioccio, L.; Henry, D; Leduc, P. Proc. IEDM Tech. Digest 2008, 595.
- 3 Van Olmen, J.; Mercha, A.; Katti, G.; Huyghebaert, C.; Van Aelst, V.; Seppala, E.; Chao, Z.; Armini, S.; Vaes, J.; Teixeira, R. C.; Van Cauwenberghe, M.; Verdonch, P.; Verhemeldonck, K.; Jourdain, A.; Ruythooren, W.; de Potter de ten Broeck, M.; Opdebeeck, A.; Chiarella, T.; Parvais, B.; Debusschere, I.; Hoffmann, T. Y.; De Wachter, B.; Dehaene, W.; Stucchi, M.; Rakowski, M.; Soussan, P.; Cartuyvels, R.; Beyne, E.; Biesemans, S.; Swinnen, B. Proc. IEDM Tech. Digest 2008, 603.
- 4 Miyakawa, N.; Hashimoto, E.; Maebashi, T.; Nakamura, N.; Sacho, Y.; Nakayama, S.; Toyoda, S. ACM J. Emerg. Technol. Comput. Syst. 2008, 4, 1.
- 5 Zweben, C. Proc. Semiconductor Thermal Meas. Manage. Symp. 2002, 30.
- 6 Bigg, D. M. Adv. Polym. Sci. 1995, 119, 1.
- 7 McCullough, R. L. Compos. Sci. Technol. 1985, 22, 3.
- 8 Yung, K. C.; Liem, H. J. Appl. Polym. Sci. 2007, 106, 3587.
- 9 Tavman, I. H. Powder Tech. 1997, 91, 63.
- 10 Sofian, N. M.; Rusu, M.; Neagu, R.; Neagu, E. J. Thermoplastic Comp. Mater. 2001, 14, 20.
- 11 Mamunya, Y. P.; Davydenko, V. V.; Pissis, P.; Lebedev, E. V. Eur. Polym. J. 2002, 38, 1887.
- 12 Tekce, H. T.; Kumlutas, D.; Tavman, I. H. J. Reinforced Plast. Comp. 2007, 26, 113.
- 13 Agari, Y.; Ueda, A.; Tanaka, M.; Nagai, S. J. Appl. Polym. Sci. 1990, 40, 929.
- 14 Ishida, H.; Rimdusit, S. Thermochim. Acta. 1998, 320, 177.
- 15 Gu, J.; Zhang, Q.; Dang, J.; Zhang, J.; Yang, Z. Polym. Eng. Sci. 2009, 49, 1030.
- 16 Li, T. L.; Hsu, S. L. C. J. Phys. Chem. B 2010, 114, 6825.
- 17 Sato, K.; Horibe, H.; Shirai, T.; Hotta, Y.; Nakano, H.; Nagai, H.; Mitsuishi, K.; Watari, K. J. Mater. Chem. 2010, 20, 2749.
- 18 Terao, T.; Zhi, C.; Banda, Y.; Mitome, M.; Tang, C.; Golberg, D. J. Phys. Chem. 2010, 114, 4340.
- 19 Guthy, C.; Du, F.; Brand, S.; Winey, K. I.; Fischer, J. E. Trans. ASME 2007, 129, 1096.
- 20 Kalaitzidou, K.; Fukushima, H.; Drzal, L. T. Carbon 2007, 45, 1446.
- 21 King, J. A.; Johnson, B. A.; Via, M. D.; Ciarkowski, C. J. Polym. Compos. 2010, 31, 497.
- 22 Tu, H.; Ye, L. J. Appl. Polym. Sci. 2010, 116, 2336.
- 23 Ng, H. Y.; Lu, X.; Lau, S. K. Polym. Compos. 2005, 26, 778.
- 24 Lee, G. W.; Lee, J. I.; Lee, S. S.; Park, M.; Kim, J. J. Mater. Sci. 2005, 40, 1259.
- 25 Milton, G. W.; Golden, K. Proc. Therm. Cond. Congress 1983, 571.
- 26 Tsutsumi, N.; Takeuchi, N.; Kiyotsukuri, T. J. Polym. Sci. B: Polym. Phys. 1991, 29, 1085.
- 27 Kim, S. R.; Kim, D. H.; Kim, D. J.; Kim, M. H.; Park, J. M. Solid State Phenomena 2007, 124, 1079.
- 28 Xu, Y.; Chung, D. D. L. Comp. Inter. 2000, 4, 243.
- 29 Lee, G. W.; Park, M.; Kim, J.; Lee, J. I.; Yoon, H. G. Comp. A Appl. Sci. Mfg. 2006, 37, 727.
- 30 Xu, Y.; Chung, D. D. L.; Mroz, C. Comp. A Appl. Sci. Mfg. 2001, 32, 1749.
- 31 Kim, D. H.; Kim, M. H.; Lee, J. H.; Lim, J. H.; Kim, K. M.; Lee, B. C.; Park, J. M.; Kim, S. R. Matl. Sci. Forum. 2007, 544/545, 483.
- 32 Leung, S. N.; Khan, M.; Chan, E.; Naguib, H.; Dawson, F.; Adinkrah, V.; Lakatos-Hayward, L. Compos B Eng, submitted.
- 33 Clingerman, M. W.; Weber, E. H.; King, J. A.; Schulz, K. H. J. Appl. Polym. Sci. 2003, 88, 2280.
- 34 Vavouliotis, A.; Fiamegou, E.; Karapappas, P.; Psarras, G. C.; Kostopoulos, V. Polym. Compos. 2010, 31, 1874.
- 35 Ahmad, F. N.; Mariatti, J.; Samayamutthirian; Khairun Azizi, M. A. Compos. Sci. Technol. 2008, 68, 346.
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