Chapter 5
Poly-SiGe Surface Micromachining
Carrie W. Low,
Sergio F. Almeida,
Emmanuel P. Quévy,
Roger T. Howe,
Carrie W. Low
TDK InvenSense, 1745 Technology Dr., San Jose, CA, 95110 USA
Search for more papers by this authorSergio F. Almeida
DiDi Labs, 450 National Ave., Mountain View, CA, 94043 USA
Search for more papers by this authorEmmanuel P. Quévy
ProbiusDx Inc., 39355 California St., Suite 207, Fremont, CA, 94538 USA
Search for more papers by this authorRoger T. Howe
Stanford University, Department of Electrical Engineering, 330 Jane Stanford Way, Stanford, CA, 94305 USA
Search for more papers by this authorCarrie W. Low,
Sergio F. Almeida,
Emmanuel P. Quévy,
Roger T. Howe,
Carrie W. Low
TDK InvenSense, 1745 Technology Dr., San Jose, CA, 95110 USA
Search for more papers by this authorSergio F. Almeida
DiDi Labs, 450 National Ave., Mountain View, CA, 94043 USA
Search for more papers by this authorEmmanuel P. Quévy
ProbiusDx Inc., 39355 California St., Suite 207, Fremont, CA, 94538 USA
Search for more papers by this authorRoger T. Howe
Stanford University, Department of Electrical Engineering, 330 Jane Stanford Way, Stanford, CA, 94305 USA
Search for more papers by this authorBook Editor(s):Masayoshi Esashi,
Masayoshi Esashi
Search for more papers by this authorSummary
Micro-electro mechanical system (MEMS) technologies have enabled chip-scale sensors, actuators, and resonators, which are fabricated using the tools of semiconductor manufacturing. Using low-temperature low-pressure chemical vapor deposition poly-SiGe as the structural material, MEMS resonators can be built directly on top of an advanced mixed-signal complementary metal oxide semiconductor (CMOS), achieving MEMS+CMOS integration in a single chip. Poly-SiGe has been investigated as alternative structural material for surface micromachining. One major drawback of poly-SiGe compared to poly-Si is its cost. Germane is an expensive gaseous precursor needed for poly-SiGe deposition. CMEMS® technology enables the modular post-processing of MEMS devices directly on top of advanced RF/mixed-signal CMOS circuitry. CMEMS® oscillators have superior long-term aging performance when compared with two-chip MEMS oscillators and quartz oscillators. CMEMS® oscillators combines the advantages of MEMS-based timing solutions while retaining and improving many of the best characteristics of traditional quartz crystals.
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