Imaging Technology, 4. Imaging for Electronics

Hartmut Steppan

Hartmut Steppan

Hoechst Aktiengesellschaft, Werk Kalle-Albert, Wiesbaden, Federal Republic of Germany

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Donald C. Mammato

Donald C. Mammato

Hoechst Celanese Corporation, Somerville, New Jersey 08876, United States

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Thomas Stoudt

Thomas Stoudt

Hoechst Celanese Corporation, Somerville, New Jersey 08876, United States

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Michael C. P. Watts

Michael C. P. Watts

Hoechst Celanese Corporation, Somerville, New Jersey 08876, United States

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First published: 15 October 2011

Abstract

The article contains sections titled:

1.

Photoresists

1.1.

Industrial Applications of Photoresists

1.2.

Function and Chemistry of Photoresists

1.2.1.

Positive Photoresists

1.2.2.

Negative Photoresists

1.3.

Testing Methods

1.4.

Economic Aspects and Suppliers of Photoresists

1.5.

Occupational Health and Environmental Protection

2.

Printed Circuits (Printed Circuit Boards)

2.1.

Methods of Producing Printed Circuit Boards

2.2.

Masking Techniques

2.2.1.

Exposure Masks

2.2.2.

Screen Printing

2.2.3.

Photoprinting

2.2.4.

Other Techniques

2.3.

Economic Aspects

2.4.

Occupational Health and Environmental Protection

3.

Microelectronic Devices

3.1.

Integrated Circuit Manufacturing

3.2.

Photoprocess

3.3.

Techniques for Submicron Lithography

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.