Semiconductor Factory Control and Optimization
Abstract
The sections in this article are
- 1 Control in Breadth
- 2 Generic Model of the Elements of a Controller
- 3 Control in Depth
- 4 Change Management
- 5 Statistical Process Control
- 6 Run-to-Run Model-Based Process Control
- 7 Equipment Signal Monitoring, Real-Time Fault Detection and Classification
- 8 Sensors
- 9 In Situ Particle Monitors
- 10 In-Line Defect Monitoring and Contamination Control
- 11 Wafer Position Tracking
- 12 Data Mining and Data Warehousing
- 13 Parametric and Yield Outlier Control
- 14 Wafer Level Reliability Control
- 15 Multivariate SPC, Especially for Equipment Signal Monitoring
- 16 Acknowledgments
Bibliography
- 1 Chrysler Corporation, Ford Motor Company, General Motors Corporation, Potential Failure Mode and Effects Analysis (FMEA), 1995.
- 2 American Supplier Institute, Quality Function Deployment for Products, 1995.
- 3 B. S. Dhilon Quality Control, Reliability and Engineering Design, New York: Dekker, 1985.
- 4 Chrysler Corporation, Ford Motor Company, General Motors Corporation, Measurement Systems Analysis, 2nd ed., 1995.
- 5 Evaluating Automated Wafer Measurement Instruments, SEMATECH Technology Transfer Document #94112638A-XFR.
- 6 D. C. Montgomery Introduction to Statistical Quality Control, 2nd ed., New York: Wiley, 1991.
- 7 Texas Instruments Statistical Process Control Guidelines.
- 8 M. J. Harry J. R. Lawson Six Sigma Producibility Analysis and Process Characterization, Reading, MA: Addison-Wesley, 1992.
- 9 Western Electric Company, Statistical Quality Control Handbook, 2nd ed., Mack, 1956.
- 10 A. V. Czitrom K. Horrell SEMATECH Qual Plan: A qualification plan for process and equipment characterization, Future Fab Int., 1 (1): 45, 1996.
- 11 Starfire from Domain Solution Corp (formerly, BBN Domain Corp), Cambridge, MA [Online]. Available www: http://www.domaincorp.com
- 12 S. W. Butler Process control in semiconductor manufacturing, J. Vac. Sci. Technol. B, Microelectron. Process. Phenom., 13: 1917–1923, 1995.
- 13 T. Smith et al. Run by run advanced process control of metal sputter deposition, Electrochem. Soc. Proc., 97 (9): 11–18, 1997.
- 14 T. E. Bensen et al. Sensor systems for real-time feedback control of reactive ion etching, J. Vac. Sci. Technol. B, Microelectron. Process. Phenom., 14: 483–488, 1996.
- 15 R. DeJule CMP challenges below a quarter micron, Semicond. Int., 20 (13): 54–60, 1997.
- 16 I. Tepermeister et al. In situ monitoring of product wafers, Solid State Technol., 39 (3): 63–68, 1996.
- 17 P. Timans Temperature measurement in rapid thermal processing, Solid State Technol., 40 (4): 63–74, 1997.
- 18 Y. Lee B. Khuri-Yakub K. Saraswat Temperature measurement in rapid thermal processing using the acoustic temperature sensor, IEEE Trans. Semicond. Manuf., 9: 115–121, 1996.
- 19 P. Biolsi et al. An advanced endpoint detection solution for <1% open areas, Solid State Technol., 39 (12): 59–67, 1996.
- 20 T. Carroll W. Ramirez On-line state and parameter identification of positive photoresist development, AIChE J., 36: 1046–1053, 1990.
- 21 G. Lu G. Rubloff J. Durham Contamination control for gas delivery from a liquid source in semiconductor manufacturing, IEEE Trans. Semicond. Manuf., 10: 425–432, 1997.
- 22 Ferran Scientific [Online]. Available www: http://www.ferran.com/main.html
- 23 S. Leang C. Spanos A novel in-line automated metrology for photolithography, IEEE Trans. Semicond. Manuf., 9: 101–107, 1996.
- 24 S. Bushman S. Farrer Scatterometry measurements for process monitoring of polysilicon gate etch, Proc. SPIE: Process, Equipment, Materials Control Integrated Circuit Manufacturing III, 3213: 79–90, 1997.
- 25 R. Patrick N. Williams C. Lee Application of RF sensors for real time control of inductively coupled plasma etching equipment, Proc. SPIE: Process, Equipment, Materials Control Integrated Circuit Manufacturing III, 3213: 67–72, 1997.
- 26 N. Hershkowitz H. L. Maynard Plasma characterization and process control diagnostics, J. Vac. Sci. Technol. A., Vac. Surf. Films, 11: 1172–1178, 1993.
- 27 L. Peters In situ particle monitoring slowly matures, Semicond. Int., 48, 1998.
- 28 Z. M. Ling et al. Analysis of within-run process variations using automated wafer-position tracking in workstream, Extended Abstracts 187th Meeting Electrochemical Soc., 95 (1): 524–525, 1995.
- 29 Wafer Sleuth Implementation Guide, SEMATECH Technol. Transfer Document 91060587A-ENG, 1991.
- 30 G. Scher Wafer tracking comes of age, Semicond. Int., 14 (6): 126–131, 1991.
- 31 Silicon supplier in line statistical process control and feedback for VLSI Manufacturing, IEEE Trans. Semicond. Manuf., 13: 1990.
- 32 McPherson, Rost, Dickerson, Wafer Level Reliability Testing, Internal Document, Texas Instruments.
- 33 C. K. Chow Projection of circuit performance distributions by multivariate statistics, IEEE Trans. Semicond. Manuf., 2: 60–65, 1989.
- 34 D. M. Hawkins Multivariate quality control based on regression-adjusted variables, Technometrics, 33: 61, 1991.
- 35 F. B. Alt Multivariate quality control, in S. Kotz and N. L. Johnson (eds.), Encyclopedia of Statistical Sciences, Vol. 6, New York: Wiley, 1985, pp. 110–122.
- 36 N. F. Hubele A multivariate and stochastic framework for statistical process control, in J. B. Keats and N. F. Hubele (eds.), Statistical Process Control in Automated Manufacturing, New York: Dekker, 1989.
- 37 T. P. Ryan Statistical methods for quality improvement, New York: Wiley, 1989.
- 38 N. D. Smith Multivariate cumulative sum control charts, Ph.D. Dissertation, Univ. of Maryland, College Park, MD, 1987.
- 39 H. Hotelling Multivariate quality control, in E. Eisenhart, M. Hastay, and W. A. Wallis (eds.), Techniques of Statistical Analysis, New York: McGraw-Hill, 1947, pp. 111–184.
- 40 N. Tracy J. Young R. Mason Multivariate control charts for individual observations, J. Qual. Technol., 24 (2): 88–95, 1992.
- 41 D. F. Morrison Multivariate Statistical Methods, New York: McGraw-Hill, 1990.
- 42 J. Prins D. Mader Multivariate control charts for grouped and individual observations, Quality Eng., 10 (1): 49–57, 1997–98.
- 43 F. B. Alt G. E. Bedewi SPC of dispersion for multivariate data, ASQC Quality Congress Trans., Anaheim, 1986, p. 248.
- 44 J. D. Healy A note on multivariate CUSUM procedures, Technometrics, 29: 409–412, 1987.
- 45 R. B. Crosier Multivariate generalizations of cumulative sum quality-control schemes, Technometrics, 30: 291, 1988.
- 46 S. Leang C. J. Spanos Statistically based feedback control of photoresist application, Proc. ASM, Boston, 1991, pp. 185–190.
- 47 F. Aparisi Sampling plans for the multivariate T2 control chart, Qual. Eng., 10 (1): 141–147, 1997–98.
- 48 J. Stefani L. Loewestein M. Sullivan On-line diagnostic monitoring of photoresist ashing, IEEE Trans. Semicond. Manuf., 8: 2–9, 1995.
- 49 L. Loewenstein J. Stefani S. W. Butler A first-wafer effect in remote plasma processing: The stripping of photoresist, silicon nitride and polysilicon, J. Vac. Soc. Tech. B, Microelectron. Process. Phenom., 12: 2810, 1994.
- 50 S. W. Butler Issues and solutions for applying process control to semiconductor manufacturing, in P. F. Williams (ed.), Plasma Processing of Semiconductors. Series E: Applied Sciences, Vol. 336, Norwell, MA: Kluwer, 1997.
- 51 B. M. Wise N. L. Ricker D. J. Veltkamp Upset and sensor failure detection in multivariate processes, AICHE Meeting, 1989.
- 52 D. Wardell H. Moskowitz R. Plante Run-length distributions of special-cause control charts for correlated processes, Technometrics, 36 (1): 3–17, 1994.
- 53 J. Lucas Discussion, Technometrics, 36 (1): 17–19, 1994.
- 54 B. Adams W. Woodall C. Superville Discussion, Technometrics, 36 (1): 19–22, 1994.
- 55 W. Fellner Discussion, Technometrics, 36 (1): 22–23, 1994.
- 56 D. Wardell H. Moskowitz R. Plante Rejoinder, Techometrics, 36 (1): 23–27, 1994.
- 57 A. Sweet Using coupled EWMA control charts for monitoring processes with linear trends, IIE Trans., 20: 404–408, 1988.
- 58 D. Montgomery C. Mastrangelo Some statistical process control methods for autocorrelated data, J. Qual. Technol., 23 (3): 179–193, 1991.
- 59 F. Faltin W. Woodall Discussion, J. Qual. Technol., 23 (3): 194–197, 1991.
- 60 J. MacGregor Discussion, J. Qual. Technol., 23 (3): 198–199, 1991.
- 61 T. Ryan Discussion, J. Qual. Technol., 23 (3): 200–202, 1991.
- 62 D. Montgomery C. Mastrangelo Response, J. Qual. Technol., 23 (3): 203–204, 1991.
- 63 D. M. Hawkins A CUSUM for a scale parameter, J. Qual. Technol., 13 (4): 228, 1981.
- 64 H. Guo C. Spanos A. Miller Real time statistical process control for plasma etching, IEEE/SEMI Int. Semicond. Manuf. Sci. Symp., 1991, pp. 113–118.
- 65 S. Lee C. Spanos Equipment analysis and wafer parameter prediction using real-time tool data, 1994 Int. Symp. Semiconductor Manufacturing, 1995, pp. 133–136.
- 66 H.-F. Guo Real time statistical process control for plasma etching, Masters Thesis, Univ. California, Berkeley, CA, 1991.
- 67 S. Lee C. Spanos Prediction of wafer state after plasma processing using real-time tool data, IEEE Trans. Semicond. Manuf., 8: 252–261, 1995.
- 68 C. Spanos et al. Real-time statistical process control using tool data, IEEE Trans. Semicond. Manuf., 5: 308–318, 1992.
- 69 S. Lee et al. RTSPC: A software utility for real-time SPC and tool data analysis, IEEE Trans. Semicond. Manuf., 8: 17–25, 1995.
- 70 G. E. P. Box G. M. Jenkins G. C. Reinsel Time Series Analysis, Forecasting and Control, 3rd ed., Englewood Cliffs, NJ: Prentice-Hall, 1988.
- 71 D. J. Wright Forecasting data published at irregular time intervals using an extension of Holt's method, Manage. Sci., 32 (4): 499–510, 1986 OR 1980.
- 72 T. H. Smith D. Boning Non-periodic lot processing, random measurement delays, and intermittent lot processing with an extended predictor corrector controller, 44th Nat. Symp. Amer. Vacuum Soc., Oct. 1997; J. Vac. Sci. Technol., 1998, submitted for publication.
- 73 S. B. Dolins A. Srivastava B. E. Flinchbaugh Monitoring and diagnosis of plasma etch processes, IEEE Trans. Semicond. Manuf., 1: 23–27, 1988.
- 74 S. B. Dolins et al. Apparatus and method for production process diagnosis using dynamic time warping. U.S. Patent No. 4,861,419, 1989.
- 75 D. White et al. Methodology for robust and sensitive fault detection, Electrochemical Soc. Proc., 97 (9): 55–63, 1997.
- 76 N. B. Gallagher et al. Development and benchmarking of multivariate statistical process control tools for a semiconductor etch process: Improving robustness through model updating, IFAC ADCHEM'97, Banff, Canada, 1997.
- 77 W. H. Woodall M. M. Ncube Multivariate CUSUM quality-control procedures, Technometrics, 27 (3): 285, 1985.
- 78 B. Wise N. Gallagher The process chemometrics approach to process monitoring and fault detection, J. Proc Cont., 6: 329–348, 1996.
- 79 D. Rocke D. Woodruff Identification of outliers in multivariate data, J. Amer. Statistical Assoc.—Theory and Methods, 91 (432): 1047–1061, 1996.
- 80 Triant Technologies, [Online]. Available http://www.triant.com.
- 81 C. A. Lowry et al. A multivariate exponentially weighted moving average control chart, Technometrics, 30: 291–303, 1988.
- 82 E. A. Rietman E. R. Lory Use of neural networks in modeling semiconductor manufacturing processes: An example for plasma etch modeling, IEEE Trans. Semicond. Manuf., 6: 343–347, 1993.
- 83 R. Shadmehr et al. Principal component analysis of optical emission spectroscopy and mass spectrometry: Application to reactive ion etch process parameter estimation using neural networks, J. Electrochem. Soc., 139: 907–914, 1992.
- 84
B. Kim
G. May
Real-time diagnosis of semiconductor manufacturing equipment using a hybrid neural network expert system,
IEEE Trans. Compon. Packag. Manuf. Technol. C,
20:
39–47,
1997.
10.1109/3476.585143 Google Scholar
- 85 M. Baker C. Himmel G. May Time series modeling of reactive ion etching using neural networks, IEEE Trans. Semicond. Manuf., 8: 62–71, 1995.
- 86 E. Rietman S. Patel A production demonstration of wafer-to-wafer plasma gate etch control by adaptive real-time computation of the over-etch time from in situ process signals, IEEE Trans. Semicond. Manuf., 8: 304–308, 1995.
Reading List
- SEMATECH: http://www.sematech.org
- I300I (dedicated to 300mm issues): http://www.i300i.org
- National Technology Roadmap: http://www.sematech.org/public/roadmap/index.htm
- Semiconductor Subway: http://www-mtl.mit.edu/semisubway.html
- Semiconductor Equipment and Materials International (SEMI): http://www.semi.org
- Semiconductor Research Corporation (SRC): http://www.semi.org/
- Semiconductor International: http://www.semiconductor-intl.com
- Solid State Technology: http://www.solid-state.com/
- Semiconductor Online: http://www.semiconductoronline.com/
- Semiconductor SuperSite.Net: http://supersite.net/semin2/docs/home.htm
- FabTech: http://www.fabtech.org
- TechWeb: http://www.techweb.com/
- Semiconductor Process Equipment and Materials Network: http://www.smartlink.net/∼bmcd/semi/cat.html
- Semiconductor.Net—The Semiconductor Manufacturing Industry Resource for Products, Services and Information: http://www.semiconductor.net/
- SemiSource, Semiconductor Resource Guide, published annually by Semiconductor International
- Solid State Technology Resource Guide, published annually by Solid State Technology
- American Vacuum Society (AVS) Buyers Guide: http://www.aip.org/avsguide
- R. J. Muirhead Aspects of Multivariate Statistical Theory, New York: Wiley, 1982.
General
Conferences and Supporting Organizations
- Electrochemical Society, Inc., http://www.electrochem.org/
- American Vacuum Society (AVS) Manufacturing Science and Technology Group (MSTG): http://www.cems.umn.edu/∼weaver/mstg/mstg-subway.html
- International Symposium on Semiconductor Manufacturing (ISSM): http://www.issm.com
- Advanced Semiconductor Manufacturing Conference (ASMC): http://www.semi.org/Education/asmc/main.html
- SPIE Microelectronic Manufacturing: http://www.spie.org/info/mm/
SC Control and Control Software
- University of Michigan Controls Group: http://www.engin.umich.edu/research/controls/
- Berkeley Computer Aided Manufacturing (BCAM): http://radon.eecs.berkeley.edu/
- Maryland University, The Institute for Systems Research: http://www.isr.umd.edu/
- SEMATECH & MIT Run by Run Benchmarking: http://www-mtl.mit.edu/rbrBench/
- TRIANT Technologies, Inc.: http://www.triant.com/
- Semy: http://www.semy.com
- Domain Solution Corp (formerly, BBN Domain Corp.), Cambridge, MA: http://www.domaincorp.com
- Umetrics, Winchester, MA: http://www.umetri.se (also good Chemometrics links)
- Brookside Software: http://www.brooksidesoftware.com/
- Brooks Automation, Richmond, BC, Canada: http://www.brooks.com/bac.htm
- Real Time Performance, Sunnyvale, CA: http://www.rp.com
- ControlWORKS, Dallas, TX: http://www.ti.com/control
- Fastech: http://www.fastech.com
- Voyan Technology, Santa Clara, CA
- V. Bakshi Fault Detection and Classification (FDC) Software Benchmarking Results, SEMATECH Technol. Rep. 97123433A-TR, 1998.
- V. Bakshi Fault Detection and Classification Software for Plasma Etchers: Summary of Commercial Product Information, SEMATECH Technol. Rep. 97083337A-XFR, 1997.
Manufacturing Execution Systems (MES)/Computer Integrated Manufacturing (CIM)/Equipment Integration Automation: Software Used to Run and Track Fab, Perform SPC, etc
- Fastech, http://www.fastech.com
- Real Time Performance, Sunnyvale, CA: http://www.rp.com
- Consillium: http://www.consilium.com/about/about.htm
- Promis: http://www.promis.com
- T. Byrd A. Maggi Challenges to plug and play CIM, Future Fab International, pp. 77–81.
- M. Greig A. Weber AMD & ObjectSpace, Inc., Future Fab International, pp. 73–74.
Inspection Tools
- KLA-Tencor, San Jose, CA: http://www.kla-tencor.com
- Orbot (owned by Applied Materials), Santa Clara, CA: http://www.appliedmaterials.com/products/pdc.html
- Inspex: (508) 667-5500.
- OSI, Fremont, California: (510) 490-6400.
Optical Review/SEM/EDS Analysis
- Ultrapointe (distributed by KLA-Tencor), San Jose, CA: http://www.ultrapointe.com/Ultrapointe/home.htm
- Leica, Deerfield, IL: http://www.leica.com
- JEOL, Peabody, MA: http://www.jeol.com
- FEI, Hillsboro, OR: [email protected]
- Hitachi Scientific Instruments, Mountain View, CA: (650) 969-1100.
- Opal (owned by Applied Materials), Santa Clara, CA: http://www.appliedmaterials.com/products/pdc.html
- Noran Instruments Inc., Middleton, WI: http://www.noran.com
- Oxford Instruments Inc., Concord, MA: http://www.oxinst.com
Data Analysis, Data Warehousing, Data Mining, Bit Mapping, Wafer Tracking, Etc
- Knight's Technlogy, Sunnyvale, CA: http://www.knights.com
- DYM, Bedford, MA: http://www.dym.com
- LPA Software, South Burlington, VT: (802) 862-2068
- Quadrillion, Company Information: http://www.quadrillion.com/quadinfo.htm
- DeviceWare Corporation: http://www.dware.com/
- Maestro, Data Management [JJT Inc.]: http://www.jjt.com/data.man.html
- Sleuthworks: http://www.sleuthworks.com/doc/
- SAS: http://www.sas.com
- KLA-Tencor, San Jose, CA: http://www.kla-tencor.com
Reliability, Parametric Testing
- Keithley Instruments Semiconductor Products: http://www.keithley.com/TIG/SBU/
Citing Literature
Wiley Encyclopedia of Electrical and Electronics Engineering
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